Vacuum Coating Laminating Machine

This equipment is designed for laminating and vapor-depositing substrates, bonding the top and bottom substrates together under vacuum conditions. The vacuum system features powerful pumping capacity, rapid vacuum recovery, and excellent vacuum performance. The machine is extremely easy to operate and maintain, and has an attractive design. It is primarily used in high-end power devices, acousto-optic modulators, MEMS sensors, infrared detectors, and other applications.

Deoxygenation and Anti-Oxidation: When metals are heated and pressed in air, a dense oxide layer (such as Al₂ O₃) forms instantly on the surface. This layer acts as an insulator, hindering atomic diffusion and leading to cold joints or increased electrical resistance. A vacuum environment completely eliminates oxygen, keeping the metal surface “active” and enabling a direct metallurgical bond between metals. Improved Wetting: The vacuum environment reduces gas adsorption on the material surface, enhancing the fluidity and wettability of the crystal or metal surface, resulting in a denser bond with fewer voids. Special Process Requirements: For silicon-to-silicon direct bonding (e.g., MEMS manufacturing) or certain compound semiconductors, atomic-level lattice matching can only be achieved under ultra-high vacuum conditions; this cannot be accomplished in a conventional environment.